| 摘要 |
<p>PURPOSE: A dicing die bonding film is provided to prevent the degradation of adhesion and separation between a film and a ring frame by removing water and/or air being put in during a semiconductor-manufacturing process through a groove formed on the adhesive part between the film and the ring frame. CONSTITUTION: A dicing die bonding film includes a substrate film; an adhesive film laminated on the substrate film; a viscous layer (110,120); an adhesive layer (130) laminated on the viscous layer; and a release film laminated on the adhesive film. A groove (300) is formed on the adhesive part between the viscous layer and a ring frame. A manufacturing method of the dicing die bonding film includes a step of forming the groove on the dicing die bonding film by inserting a blade, which penetrates through the substrate film and a part of the viscous layer, on which the adhesive layer is not laminated, up to a height not penetrating the release film.</p> |
