发明名称 The printed circuit board and the method for manufacturing the same
摘要 PURPOSE: A printed circuit board and a manufacturing method thereof are provided to save cost and to reduce a process step compared to the case of forming a hard insulation layer into a multilayer. CONSTITUTION: A rigid flexible printed circuit board(100) includes a flexible region(A) and a rigid region(B). The flexible region includes a flexible insulation layer in which a first circuit pattern is formed. The rigid region is formed to be adjacent to the flexible region and includes a flexible insulation layer(133), a rigid insulation layer(160) and a circuit pattern(140,170). A base board(110) forms a base circuit pattern(120). The base circuit pattern includes the first circuit pattern arranged in the flexible region.
申请公布号 KR101283164(B1) 申请公布日期 2013.07.05
申请号 KR20110110829 申请日期 2011.10.27
申请人 发明人
分类号 H05K1/18;H05K3/46 主分类号 H05K1/18
代理机构 代理人
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