CHIP ON BOARD LIGHT-EMITTING DIODE PACKAGE OF HIGH RADIATION

摘要

PURPOSE: A high heat radiation COB LED package is provided to easily discharge heat from an LED chip by forming a step on the inner side of a frame of a PCB. CONSTITUTION: A metal substrate (10) is formed with a planar shape. An LED chip (30) is installed in the center of the upper side of the metal substrate. A PCB (50) is installed on the upper side of the metal substrate. An LED chip mounting unit (53) is formed on the inner side of a frame (51) of a PCB with a hollow shape. The frame of the PCB has a two-layered structure with a step.