RESIN COMPOSITION FOR FIXING A LEAD OF SEMICONDUCTOR AND THE TAPE FOR FIXING A LEAD

摘要

PURPOSE: A resin composition for fixing a semiconductor lead is provided to offer high temperature attachment and high voltage reliability, and to improve heat-proof resistance and physical rigidity by increasing the crosslinking density of an adhesive. CONSTITUTION: A resin composition for fixing a semiconductor lead contains an epoxy resin, a curing agent, a thermoplastic resin, an additive, and a phosphorus compound denoted by chemical formula 1. In the chemical formula 1, R1-R15 are the same or different, and are independently H or a C1-6 alkyl group. A lead fixing tape using the resin composition for fixing the semiconductor lead is obtained by coating the resin composition on a supporting base film, and laminating a protective film on the coated composition.