ADHESIVE COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM COMPRISING THE SAME

摘要

PURPOSE: An adhesive film is provided to remove a PCB baking process and a PCB plasma process by expressing proper adhesive force only with a chip adhering process. CONSTITUTION: A semiconductor adhesive film has die share intensity after adhering a chip greater than 4 kgf/chip at 120 deg. C for 5 seconds, and greater than 2×10^6dyne/cm^2 at 150 deg. C after more than 20 minutes. An adhesive composition for a semiconductor contains 51-80 parts of thermoplastic resin by weight, 5-20 parts of epoxy resin by weight, 2-10 parts of phenol type hardened resin by weight, 2-10 parts of amine-based hardened resin by weight, and 0.1-10 parts of hardening accelerator for 100 parts of solid portion by weight.