发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device with high productivity and low cost by omitting manufacturing processes; and a semiconductor device with reduced power consumption and increased reliability.SOLUTION: A semiconductor device used in a display device is manufactured through at least four photolithography processes, namely, forming a gate electrode, forming a source electrode and a drain electrode, forming a contact hole, and forming a pixel electrode, where a process for forming an island-shaped semiconductor layer is omitted. In the step for forming the contact hole, a groove portion in which a semiconductor layer is removed is formed, thereby preventing formation of a parasitic transistor. An oxide semiconductor is used for the semiconductor layer in which a channel is formed, and an oxide semiconductor having a higher insulating property than the semiconductor layer is formed over the semiconductor layer.
申请公布号 JP2013131742(A) 申请公布日期 2013.07.04
申请号 JP20120254985 申请日期 2012.11.21
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;KOYAMA JUN
分类号 H01L21/336;G02F1/1368;H01L21/764;H01L29/786;H01L51/50;H05B33/08;H05B33/26 主分类号 H01L21/336
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