WAFER EXPOSURE METHOD, MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATION PIECE, MASK FOR WAFER EXPOSURE, AND MANUFACTURING APPARATUS OF PIEZOELECTRIC VIBRATION PIECE

摘要

PROBLEM TO BE SOLVED: To easily and unfailingly peel a resist film from a photo mask while preventing the resist film from being peeling from a wafer and being damaged.SOLUTION: In addition to a through hole M1a provided at a position facing an outer peripheral part of a resist film 25, a through hole M2a is provided at a position facing a center part of the resist film 25 and air is also jetted from the through hole M2a. Even when a film thickness of an outer peripheral edge part of the resist film 25, formed on a surface of a wafer S by a spin coat method, is larger than a film thickness of the inner peripheral side, the structure allows air to be injected from the through hole M2a to a space between the resist film 25 and a lower mask M1 to unfailingly separate the resist film 25 from the lower mask M1.