| 摘要 |
PROBLEM TO BE SOLVED: To provide a lamination type semiconductor device capable of detecting connection failures even for a terminal that cannot be contacted directly from outside and that is not a target of a boundary scan inspection method.SOLUTION: In a semiconductor device including a first semiconductor chip (Slice0) and a second semiconductor chip (Slice1), the second semiconductor chip Slice1 has a testing circuit (a testing circuit part 51). The testing circuit includes a node (a connection point Node1 (a second layer)) charged in response to a first signal (a testing signal/TEST) supplied from the first semiconductor chip Slice0 and discharged in response to a second signal (a signal inputted to testing pads TP20-TP2n) supplied from the first semiconductor chip Slice0. The testing circuit is arranged between its own terminal (bump electrodes B20-B2n) and its own input buffer (input buffers 220-22n). |
