SHEET FOR FORMING RESIN FILM FOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a sheet for forming a resin film for chip which allows the impartation of a gettering function to a semiconductor device formed with the sheet without the need for performing a special treatment that makes the process more complicated.SOLUTION: A sheet for forming a resin film for chip according to the invention comprises: a support member; and a resin film-forming layer formed on a peeling face of the support member. The resin film-forming layer comprises (A) a binder polymer component, (B) a curable component, and (C) a gettering agent. The sheet is used to form a resin film on a polished face side of a chip by the step of transferring the resin film-forming layer from the support member to a polished face of a silicon wafer, and curing and dicing steps subsequent thereto. The arithmetic average surface roughness Ra of the polished face of the silicon wafer is 0.01 μm or smaller.