DICING SHEET WITH PROTECTIVE FILM-FORMING LAYER, AND METHOD FOR PRODUCING CHIP

摘要

[Problem] To provide a dicing sheet with a protective film-forming layer, which enables easy production of a semiconductor chip that has a protective film having high uniformity and excellent printing accuracy, which has excellent chip affixing ability during dicing, and wherein the protective film and a base film can be easily separated from each other. [Solution] A dicing sheet with a protective film-forming layer of the present invention is characterized by comprising a protective film-forming layer on an adhesive layer of an adhesive sheet with a peel strength adjusting layer being interposed therebetween, said adhesive sheet being composed of a base film and the adhesive layer. This dicing sheet with a protective film-forming layer is also characterized in that: a laminate of the peel strength adjusting layer and the protective film-forming layer is arranged in the inner circumferential part of the adhesive sheet; the adhesive layer is exposed in the outer circumferential part of the adhesive sheet; and the peel strength between the peel strength adjusting layer and a protective film that is obtained by curing the protective film-forming layer is 0.05-5 N/25 mm.