METHOD OF MANUFACTURING A SUBSTRATE FOR ARRAYING LED CHIPS AND SUBSTRATE FOR ARRAYING LED CHIPS

摘要

PURPOSE: A method for manufacturing an LED chip array substrate and the LED chip array substrate are provided to have stable thermal conductivity and withstand voltage characteristic by forming an additional polymer coating layer on an insulating layer formed by an anodic oxidation process. CONSTITUTION: A base made of aluminum is prepared. An anodic oxidation process is performed on the base to form an insulating layer made of alumina on the surface of the base. The base is dipped in a polymer solution to form a polymer coating layer. The polymer coating layer is heat-treated. A direct printing process is performed on the polymer coating layer by using a conductive paste composition in order to form a circuit pattern. [Reference numerals] (AA) Thickness of a AI_2O_3 layer 10 μm