发明名称 |
PHENOLIC RESIN COMPOSITION, AND METHODS FOR MANUFACTURING CURED RELIEF PATTERN AND SEMICONDUCTOR |
摘要 |
Provided is a photopolymer composition for a semiconductor element surface protective film or an interlayer insulating film, in which a solution of the photopolymer composition comprises 100 parts by mass of (A) a phenolic resin having a biphenyldiyl structure in a main chain of the resin; 1 to 30 parts by mass of (B) a photo acid-generating agent; and 1 to 60 parts by mass of (C) a compound that can be reacted with ingredient (A) by means of an acid generated from the photo acid-generating agent or heat.
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申请公布号 |
US2013168829(A1) |
申请公布日期 |
2013.07.04 |
申请号 |
US201113820772 |
申请日期 |
2011.09.12 |
申请人 |
SASAKI TAKAHIRO;LI JUN;ASAHI KASEI E-MATERIALS CORPORATION |
发明人 |
SASAKI TAKAHIRO;LI JUN |
分类号 |
G03F7/004;H01L21/30;H01L29/06 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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