VACUUM SEALING PROCESS OF A MEMS PACKAGE

摘要

A vacuum sealing process of a micro-electrical-mechanical-system (MEMS) package is provided. Solder is applied to the rimmed bottom of a lid for the package. A micro-electro-mechanical system (MEMS) device is attached to a substrate for the package. Solder is applied to a lipped top of the substrate. The lid and the substrate are sealed in an elevated temperature and vacuum environment.