| 摘要 |
Provided is a die pickup device for picking up a die from a wafer and putting the die on a substrate. The die pick device includes a pickup head for picking up the die, a handle portion and a connecting portion connected between the pickup head and the handle portion. The handle portion is substantially ring-shaped and defines a central opening. An end of the connecting portion connected to the pickup head faces toward a center of the central opening.
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