OPTICAL PROXIMITY CORRECTION METHOD

摘要

An optical proximity correction method, based on an optical proximity correction process. By adding a step of determining and modifying an indentation when performing an OPC processing on a metal line, a concave-convex structure in the metal line is able to achieve the optimal indentation when an OPC correction is performed, thus deformation and deviation found between a mask graphic and a photolithography graphic acquired on an actual silicon wafer are reduced, thereby improving the circuit performance of a product and the production yield.