发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p>PURPOSE: A substrate processing apparatus is provided to rapidly and uniformly cool a substrate by uniformly supplying gases to convert the inside of a load lock chamber from a vacuum state to an atmospheric pressure state. CONSTITUTION: A chamber provides a space for processing a substrate. A gas spray unit (200) sprays gases to a substrate support unit. The gas spray unit contacts one side of a body (202) with an inner wall of the chamber. A groove (204) is formed on one side of the body. The gas spray unit includes a plurality of gas spray holes (206) which are regularly arranged along a gas flow path.</p>
申请公布号 KR20130074416(A) 申请公布日期 2013.07.04
申请号 KR20110142475 申请日期 2011.12.26
申请人 WONIK IPS CO., LTD. 发明人 NOH, TAE SUB;KO, DONG SUN;NA, HUN HEE;CHOI, JUNG HOON
分类号 H01L21/677;H01L21/205 主分类号 H01L21/677
代理机构 代理人
主权项
地址