| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of equalizing or shortening lengths of a wire connecting between a controller and an external connection terminal and a wire connecting between the controller and a memory chip, and of suppressing warpage of products.SOLUTION: A semiconductor device 50 has: a substrate to which an external connection terminal 12 is formed; a controller 4 mounted on a first surface 2a of the substrate 2; a first spacer 6a arranged on one side of the controller 4 and made of a resin; a second spacer 6b mounted on an opposite side to the first spacer 6a across the controller 4 and made of a resin; a memory chip 8 mounted on the first spacer 6a and the second spacer 6b stretching over the first spacer 6a and the second spacer 6b; and a resin mold part 10 encapsulating a space 18 surrounded by the memory chip 8, the first spacer 6a, the second spacer 6b, and the substrate 2, and the circumference of the memory chip 8. |
