THERMOCONDUCTIVE RESIN COMPOSITION

摘要

Provided is a thermoconductive resin composition with excellent moldability and which can be rendered thermoconductive by being made to contain a specific thermoconductive inorganic filler, without increasing the quantity of filler contained. The thermoconductive resin composition contains a thermoconductive filler and a binder resin, and the thermoconductive filler is an irregularly-shaped filler having recesses and protrusions on the surface.