TAPE CUTTING APPARATUS FOR ELECTRONIC COMPONENT PACKAGING APPARATUS, JIG FOR ATTACHING/DETACHING TAPE CUTTING APPARATUS, AND ELECTRONIC COMPONENT PACKAGING APPARATUS

摘要

A tape cutting apparatus (14) for an electronic component packaging apparatus is provided with: a cutter (30), which is positioned below a tape feeder attached to the electronic component packaging apparatus, and which cuts a tape ejected from the tape feeder; and a supporting frame (31), which is detachably attached to a base of the electronic component packaging apparatus in a state wherein the supporting frame is supporting the cutter (30). In a state wherein the supporting frame (31) is attached to the electronic component packaging apparatus, operations of the cutter (30) are controlled by means of a control apparatus of the electronic component packaging apparatus.