发明名称 APPARATUS OF INGOT SLICING AND METHOD OF INGOT SLICING
摘要 PURPOSE: An ingot cutting device and an ingot cutting method are provided to cut an ingot while minimizing the deformation of the ingot as the different surfaces of the ingot are cut at the same time. CONSTITUTION: An ingot cutting device includes wires (111), roller units, and a slurry nozzle (120). The slurry nozzle includes a plurality of slurry holes for supplying slurries (S) to the wires. As a plurality of rollers (101,102,103) of the roller units cut an ingot in different directions, the ingot is easily cut even though the rollers move to a half point or further on the ingot. The rollers rotate the wires by winding, and the ingot is rotated by a driving unit (130).
申请公布号 KR20130074711(A) 申请公布日期 2013.07.04
申请号 KR20110142888 申请日期 2011.12.26
申请人 LG INNOTEK CO., LTD. 发明人 SON, CHANG HYUN;HEO, SEON
分类号 B28D5/04;B24B27/06;B26D1/547;H01L21/304 主分类号 B28D5/04
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