WIRE CLEANING UNIT AND WIRE SAW APPARATUS INCLUDING THE SAME

摘要

PURPOSE: A wire cleaning unit and a wire saw apparatus including the same are provided to improve the quality of a wafer by preventing saw mark defects. CONSTITUTION: A first bath (210) accommodates a cleaning solution. A first guide roller (220) is located in the first bath. The first guide roller guides a wire to be dipped in the cleaning solution. A second bath (230) surrounds the first bath. The second bath is installed on the outside of the first bath.