发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which can make a semiconductor element operate normally even when variations in transmission characteristics in a wiring conductor are eliminated and a high-frequency signal is transmitted to the wiring conductor.SOLUTION: The wiring board comprises: an insulating substrate 1 having a mount part 1a on which a semiconductor element S is mounted; a plurality of semiconductor element connection pads 4 arranged on a top face of the mount part 1a so as to have different distances from an outer periphery of the mount part 1a; a plurality of wiring conductors 2 extending on a top face of the insulating substrate 1 from the semiconductor element connection pads 4 to the outside of the mount part 1a; and a solder resist layer 3 attached so as to cover a top face of the insulating substrate 1, and having an opening 3a collectively exposing all of the semiconductor element connection pads 4 at the mount part 1a and a part of the wiring conductors 2, and covering the rest part of the wiring conductors 2. The opening 3a is formed in a shape so as to make exposure lengths of the wiring conductors 2 connected to the semiconductor element connection pads 4 be the same.
申请公布号 JP2013131625(A) 申请公布日期 2013.07.04
申请号 JP20110280012 申请日期 2011.12.21
申请人 KYOCER SLC TECHNOLOGIES CORP 发明人 NAGASHIMA HIROAKI
分类号 H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址