| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin molded product having low water absorbability, a resin composition giving the resin molded product, and a cable using the resin molded product.SOLUTION: The resin molded product includes (A) an epoxy resin represented by formula (I) or the like and (B) a curing agent represented by formula (III) or the like, wherein (C) one or more of R-Ror one or more of R-Rare a branched-chain alkyl group. The cable has an insulating layer covering a conducting body and the insulating layer comprises the resin molded product. In formula (I), R-Rare independently a branched-chain alkyl group, a hydrogen atom, a divalent linking group, or an epoxy group bonded via a single bond; n-nare each independently an integer of 0-3; the number of the epoxy group in the formula is 1-3; and a part or all of the hydrogen atoms forming the branched-chain alkyl group may be replaced by fluorine atoms. In formula (III), R-Rare each independently a nucleophilic group, a branched-chain alkyl group or a hydrogen atom; n-nare each independently an integer of 0-3; the number of the nucleophilic groups in the formula is 1-3; the number of the branched-chain alkyl groups in the formula is one or more; and a part or all of the hydrogen atoms forming the branched-chain alkyl group may be replaced by fluorine atoms. |
