| 摘要 |
PROBLEM TO BE SOLVED: To provide a polymerizable composition that can obtain a crosslinking resin, a crosslinking resin composite or a crosslinking resin laminate that is suitable for an electric circuit board or the like, in which a dielectric loss tangent in a high-frequency region is small, and that are excellent in the characteristics of insulation, adhesion, mechanical strength, heat resistance, dielectric property or the like.SOLUTION: The polymerizable composition includes: a cycloolefin-based monomer (A1) that has a benzocyclobutene structure; other cycloolefin-based monomers (A2); a metathesis polymerization catalyst (B); and a chain transfer agent (C). A crosslinkable resin, a crosslinkable resin composite or a crosslinkable resin laminate is obtained by massiveness polymerizing the polymerizable composition. The crosslinking resin, the crosslinking resin composite or the crosslinking laminate is obtained by crosslinking the crosslinkable resin, the crosslinkable resin composite or the crosslinkable resin laminate. |
