发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a base substrate; a circuit layer including a connection pad having a vertically etched upper portion and formed on the upper portion of the base substrate; a solder resist layer formed on the upper portion of the base substrate and including an opening part exposing the connection pad; and a surface treatment layer formed on the upper portion of the connection pad exposed by the opening part.
|
申请公布号 |
US2013168132(A1) |
申请公布日期 |
2013.07.04 |
申请号 |
US201213729666 |
申请日期 |
2012.12.28 |
申请人 |
SUMSUNG ELECTRO-MECHANICS CO., LTD.;SUMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE CHANG BAE;KIM JIN GU;KWEON YOUNG DO |
分类号 |
H05K3/00;H05K1/11 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|