发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 When a connected position detecting unit detects that a connected position of a tape reaches a predetermined position in the tape passage, head-feeding of an electronic component provided in a head of the connected new tape is provided. In the head-feeding, a tape feeder feeds the tape such that the electronic component in the head of the new tape is located in a component pickup port. When the connected position detecting unit detects that the connected position of the tape reaches the predetermined position in the tape passage, a mounting head picks up the electronic component from the new tape fed by the head feeding control unit and is mounted on a new board positioned by a board conveying path.
申请公布号 US2013167361(A1) 申请公布日期 2013.07.04
申请号 US201113821052 申请日期 2011.08.23
申请人 KAWAGUCHI TEPPEI;MAWATARI MICHIAKI;PANASONIC CORPORATION 发明人 KAWAGUCHI TEPPEI;MAWATARI MICHIAKI
分类号 H05K7/00 主分类号 H05K7/00
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