| 摘要 |
A reflow furnace (1) has a depressurization chamber (5), and bubbles contained in molten solder on a substrate (7) are removed in the depressurization chamber (5). The substrate (7), which is supported by a first transportation rail (8), is delivered into the depressurization chamber (5) by a first transportation rod (18). The substrate (7) in the depressurization chamber (5) is extracted by a second transportation rod (32), and transported to the exit of the reflow furnace (1) while being supported by a second transportation rail (9). The width of the first transportation rail (8) and the width of the second transportation rail (9) are adjusted prior to processing a substrate (7) having a different width dimension. When this adjustment is performed, the second transportation rod (32) is displaced in the width direction of the substrate (7) in a state in which the second transportation rod (32) is intruding in the depressurization chamber (5), and the spacing between left and right rail parts (12a, 12a) in the depressurization chamber (5) is adjusted at the same time. |
