| 摘要 |
<p>In a conventional high-speed large-current semiconductor chip, all electrical connection terminals are disposed on one surface of the chip. For this reason, a large number of terminals have been assigned for power supply current flowing-in terminals and power supply current flowing-out terminals in order to supply stable power supply current and reduce noise mixed in a signal system from a power supply. Consequently, there have been the problems of increase in the number of terminals of a semiconductor device mounted with said semiconductor chip and increase in mounting area. Electrical connection terminals are sorted into the terminals of a power supply system and the terminals of a signal system and are disposed on both sides of a semiconductor chip. A configuration that increases the allowable current value of a flow path through which a large current flows makes it possible, for example, to supply a stable power even with a small number of terminals, reduce noise mixed in the signal system, reduce the mounting area by the reduction of the number of pins, and increase a heat dissipation effect. With a semiconductor module mounted with this semiconductor chip, stable characteristics can also be obtained even in a high-speed operation with large current flow.</p> |
