METHOD OF CUTTING LIGHT-EMITTING DEVICE CHIP WAFER BY USING LASER SCRIBING

摘要

Methods of cutting a light-emitting device chip wafer by using a laser scribing process. The method includes: preparing a wafer that has a plurality of semiconductor chips on an upper surface of the wafer; attaching a first tape covering the semiconductor chips to the upper surface of the wafer; forming scribing lines to define each of the semiconductor chips on the wafer by irradiating a laser beam onto a lower surface of the wafer; attaching a second tape to the lower surface of the wafer; and breaking the wafer into a plurality of chips by applying a physical force to the wafer along the scribing lines.