发明名称 |
Semiconductor Package with Ultra-Thin Interposer Without Through-Semiconductor Vias |
摘要 |
There are disclosed herein various implementations of semiconductor packages including an interposer without through-semiconductor vias (TSVs). One exemplary implementation includes a first active die situated over an interposer. The interposer includes an interposer dielectric having intra-interposer routing traces. The first active die communicates electrical signals to a package substrate situated below the interposer utilizing the intra-interposer routing traces and without utilizing TSVs. In one implementation, the semiconductor package includes a second active die situated over the interposer, the second active die communicating electrical signals to the package substrate utilizing the intra-interposer routing traces and without utilizing TSVs. Moreover, in one implementation, the first active die and the second active die communicate chip-to-chip signals through the interposer.
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申请公布号 |
US2013168860(A1) |
申请公布日期 |
2013.07.04 |
申请号 |
US201113339234 |
申请日期 |
2011.12.28 |
申请人 |
KARIKALAN SAMPATH K.V.;ZHAO SAM ZIQUN;HU KEVIN KUNZHONG;KHAN REZAUR RAHMAN;VORENKAMP PIETER;CHEN XIANGDONG;BROADCOM CORPORATION |
发明人 |
KARIKALAN SAMPATH K.V.;ZHAO SAM ZIQUN;HU KEVIN KUNZHONG;KHAN REZAUR RAHMAN;VORENKAMP PIETER;CHEN XIANGDONG |
分类号 |
H01L23/538;H01L23/532 |
主分类号 |
H01L23/538 |
代理机构 |
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地址 |
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