| 摘要 |
PURPOSE: A substrate processing device is provided to accurately control a process by reducing particles during processing of a substrate. CONSTITUTION: A susceptor (130) supports a substrate in a process chamber (100a). A support unit (100b) is separately located on the upper side of the susceptor. A gas spray unit (110) is installed on the support unit and sprays process gas to the substrate. A protection member (120) is installed on the upper side of the gas spray unit. A coating film (A) is formed on the surface of the protection member to face the susceptor.
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