发明名称 |
METHOD FOR FORMING A LIGHT CONVERSION MATERIAL |
摘要 |
A method and system for manufacturing a light conversion structure for a light emitting diode (LED) is disclosed. The method includes forming a transparent, thermally insulating cover over an LED chip. The method also includes dispensing a conversion material onto the cover to form a conversion coating on the cover, and encapsulating the LED, the silicone cover, and the conversion coating within an encapsulant. Additional covers and conversion coatings can be added.
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申请公布号 |
US2013168719(A1) |
申请公布日期 |
2013.07.04 |
申请号 |
US201313780136 |
申请日期 |
2013.02.28 |
申请人 |
MICRON TECHNOLOGY, INC.;MICRON TECHNOLOGY, INC. |
发明人 |
WATKINS CHARLES M.;TETZ KEVIN;GEHRKE THOMAS |
分类号 |
H01L33/44 |
主分类号 |
H01L33/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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