| 发明名称 |
Sn-Cu-BASED LEAD-FREE SOLDER ALLOY |
| 摘要 |
Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass% of Cu and 0.01 to 0.1 mass% of Al are contained, 0.02 to 0.1 mass% of Ti and/or 0.01 to 0.05 mass% of Co may be contained as required and the remainder is made up by Sn. |
| 申请公布号 |
WO2013099849(A1) |
申请公布日期 |
2013.07.04 |
| 申请号 |
WO2012JP83438 |
申请日期 |
2012.12.25 |
| 申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
OHNISHI TSUKASA;YOSHIKAWA SHUNSAKU;ISHIBASHI SEIKO;FUJIMAKI REI |
| 分类号 |
B23K35/26;B23K1/00;B23K35/14;B23K101/40;C22C13/00;H05K3/34 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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