摘要 |
A method of metalizing a surface of an insulation substrate is provided and an article obtainable by the method is also provided. The method may comprise the steps of: applying an ink composition onto a surface to be metalized of the insulation substrate, obtaining an insulation substrate with an ink layer; subjecting the insulation substrate with an ink layer to heat treatment at a temperature of about 500 to 1000 degree Celsius in an non-reactive atmosphere; plating at least one metal layer on the ink layer, the ink composition comprises a metal compound and an ink vehicle, the metal compound is at least one selected from a group consisting of a nano-copper oxide, a nano- cuprous oxide, a compound of formula (I) and a compound of formula (II), Tau&idigr;O2-sigma (I), M1M2 pOq (II), 0.05<=sigma<= 1.8, M1 is at least one element selected from a group consisting of groups 2, 9-12 of the periodic table according to IUPAC nomenclature, M2 is at least one element selected from a group consisting of groups 3-8,10 and 13 of the periodic table according to IUPAC nomenclature, 0<p<=2, and 0<q<4. |