| 摘要 |
The invention relates to a contact system (74, 75). The contact system comprises at least one electronic component (20, 22) in particular. The component has at least one electrical connection (24, 26). The contact system has at least one electrically conductive layer (10, 11). The connection of the component to the electrically conductive layer is achieved by means of an electrically conductive connecting means. According to the invention the electrically conductive connecting means is partly (50, 52, 54, 56, 57, 59) produced by means of a thermal injection method and partly (51, 53, 55, 58, 63, 64) by means of electroplating. |
