发明名称 INCREASING CURRENT CARRYING CAPABILITY THROUGH DIRECT LIQUID COOLING OF TEST CONTACTS
摘要 <p>Testing methods and systems are described. One method for testing an electronic device includes providing a probe in electrical contact with a device. The method also includes positioning an interface of the probe and the device in a liquid medium. The method also includes transmitting a current from the probe through the interface while the interface is in the liquid medium. Other embodiments are described and claimed.</p>
申请公布号 WO2013101239(A1) 申请公布日期 2013.07.04
申请号 WO2011US68272 申请日期 2011.12.31
申请人 INTEL CORPORATION;CRIPPEN, WARREN S.;GROSSMAN, BRETT;SWART, ROY E.;TADAYON, POOYA 发明人 CRIPPEN, WARREN S.;GROSSMAN, BRETT;SWART, ROY E.;TADAYON, POOYA
分类号 H01L21/66 主分类号 H01L21/66
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