A semiconductor device includes a plurality of semiconductor elements each having a front surface and a back surface; a front surface-side heatsink that is positioned on a front-surface side of the semiconductor elements and dissipates heat generated by the semiconductor elements; a back surface-side heatsink that is positioned on a back surface-side of the semiconductor elements and dissipates heat generated by the semiconductor elements; a sealing material that covers the semiconductor device except for a front surface of the front surface-side heatsink and a back surface of the back surface-side heatsink; a primer that is coated on at least one of the front surface-side heatsink and the back surface- side heatsink and improves contact with the sealing member; and a protruding portion positioned between the plurality of semiconductor elements, on at least one of the back surface of the front surface-side heatsink and the front surface of the back surface-side heatsink.
申请公布号
WO2013098629(A1)
申请公布日期
2013.07.04
申请号
WO2012IB02777
申请日期
2012.12.21
申请人
TOYOTA JIDOSHA KABUSHIKI KAISHA;DENSO CORPORATION;KADOGUCHI, TAKUYA;IWASAKI, SHINGO;MIYAZAKI, TOMOHIRO;NISHIHATA, MASAYOSHI;OKUMURA, TOMOMI