| 摘要 |
PROBLEM TO BE SOLVED: To secure electric connection reliability.SOLUTION: A printed circuit board 1 has such a structure that first to fifth printed wiring substrates 10-50 are collectively laminated by thermocompression bonding. Land units 13-53 are formed on the respective printed wiring substrates 10-50, and electrically connected to each other by interlayer connecting vias 14, 24, 44, and 54 made of conductive paste filled in via holes formed on respective resin substrates 11, 21, 41, and 51, and an inter-conductor connecting via 34 plating-formed in a via hole formed on a third resin substrate 31. Through holes 60 penetrating through the printed circuit board 1 are formed on the respective land units 13-53, and the respective vias 14-54 are arranged around the through holes 60. The via 34 is arranged offset from the other vias 14, 24, 44, and 54 when seen from a lamination direction. |
