SYSTEM FOR SPLITTING OF BRITTLE MATERIALS WITH TRENCHING TECHNOLOGY

摘要

One aspect related to a system configured to split a processed semiconductor wafer. The semiconductor wafer comprises a brittle material and has at least one layer formed on a first surface of the semiconductor wafer. At least one trench is etched in the first surface and through the at least one layer thereby forming a line on the surface where at least some of the brittle material is removed. Provided are means for splitting the semiconductor wafer into separate pieces along the line.