发明名称 WIRING BOARD AND MANUFACTURING METHOD THEREFOR
摘要 <p>A wiring board comprises: an electrically insulated base material comprising a non-compressed member and a thermosetting member; a first wiring and a second wiring that are formed with the electrically insulated base material interposed therebetween; and via-hole conductors that penetrate the electrically insulated base material, and electrically connect the first wiring and the second wiring. The via-hole conductors comprise resin sections and metal sections. The metal sections comprise first metal sections the main ingredient of which is Cu, second metal sections the main ingredient of which is Sn-Cu alloy, and third metal sections the main ingredient of which is Bi. The second metal section is larger than the first metal section, and larger than the third metal section.</p>
申请公布号 WO2013099204(A1) 申请公布日期 2013.07.04
申请号 WO2012JP08234 申请日期 2012.12.25
申请人 PANASONIC CORPORATION 发明人 IWASAKI, AKITO;NAKAMURA, TADASHI;HIMORI, TSUYOSHI;HONJO, KAZUHIKO
分类号 H05K3/46;H05K1/11;H05K3/40 主分类号 H05K3/46
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