| 摘要 |
A multilayer film including: a substrate consisting of a resin that contains a polymer having an alicyclic structure, the substrate having a thickness of not more than 45 mum; and a resin layer provided on at least one surface of the substrate, the resin layer being formed by curing by irradiation of an active energy ray, wherein: a ratio of the substrate thickness relative to the total of the substrate thickness and the resin thickness is not less than 0.6 and not more than 0.95, and in a temperature range of not less than 30° C. and not more than 90° C., a linear expansion coefficient of the multilayer film is smaller than a linear expansion coefficient of the substrate by 5 ppm/° C. or more.
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