DRY FILM, LAYERED STRUCTURE, PRINTED WIRING BOARD, AND PROCESS FOR PRODUCING LAYERED STRUCTURE

摘要

A dry film is provided from which it is possible to obtain a solder resist having excellent resolution while retaining various properties including pressure cooker test characteristics. Also provided are a layered structure, e.g., a printed wiring board, and a process for producing the layered structure. The dry film comprises a film and a photosensitive resin layer formed on the film, and is characterized in that the absorption coefficient (alpha) of the photosensitive resin layer at a wavelength of 365 nm has a gradient in which the coefficient (alpha) increases or decreases from the surface of the photosensitive resin layer toward the surface of the film.