| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate plating device capable of preventing a plating defect, and capable of improving reliability of a plating film thickness distribution, and to provide a control method of the same.SOLUTION: A substrate plating device includes: a constant current unit 10 for supplying power; a cathode hanger 200 including a number of clamps for fixing a substrate 100, a hall current sensor 212 attached to each of the clamps and for detecting current information, and a wireless communication module 220 coupled to the hall current sensor 212 and for wirelessly transmitting the current information to an external; a current rail 20 with a number of cathode hangers 200 attached to an upper part of a plating tank 50 and being coupled with the constant current unit 10; and an anode unit 30 extended and coupled from the constant current unit 10, and being precipitated in a plating liquid 55 of the plating tank 50. |
