发明名称 ELECTRONIC COMPONENT LOADING METHOD AND ELECTRONIC COMPONENT LOADING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component loading method or an electronic component loading device, which does not manufacture a defective substrate by connecting a wrong housing tape which houses a different electronic component when performing splicing, relating to a feeder that is not used for a current product.SOLUTION: A splicing process is performed on a feeder that is used only for a next generation product during manufacturing of a current product. The splicing registration information is registered which includes normal information in which the splicing process has been correctly performed or failure information in which the splicing has failed. Before starting manufacturing of a next generation product, based on the splicing registration information, a next generation product feeder which requires splicing again is discriminated. Based on the discrimination result, the next generation product feeder is subjected to the splicing process again, and after completion of the second splicing process, the next generation product is manufactured.
申请公布号 JP2013131633(A) 申请公布日期 2013.07.04
申请号 JP20110280183 申请日期 2011.12.21
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 HAYASHI KATSUNORI;KAWABATA YOSHIHIRO;YOKOYAMA YASUYUKI
分类号 H05K13/02 主分类号 H05K13/02
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