| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that eliminates a case such that although a second connection part is accommodated in a second accommodation hole, a connector body part is not housed in a first storage hole, and improves the product yield of the semiconductor device.SOLUTION: There is provided the method of manufacturing the semiconductor device including a separate alignment process S10 of separating and aligning a plurality of connectors each having a connector body part with a first connection part and a second connection part provided integrally with the connector body part using an alignment tool having a plurality of accommodation holes comprising first accommodation holes having a shape corresponding to the connector body part and second accommodation holes having a shape corresponding to the second connection part, and a connection process of taking out a connector aligned in the separation and alignment process S10, and electrically connecting a semiconductor chip and a lead frame through the connector, and using a connector having a second connection part in a rotationally asymmetrical plane shape as a connector. |
