发明名称 |
DICING SHEET WITH PROTECTIVE FILM FORMING LAYER AND CHIP MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer, which enables simple manufacturing of a semiconductor chip having a highly uniform thickness and excellent printing precision; and in which the protective film forming layer is cured and adhesion of a pressure-sensitive adhesive sheet is reduced in a heating process thereby to achieve easy pickup of the semiconductor chip having the protective film and a simple manufacturing process of the semiconductor chip.SOLUTION: A dicing sheet with a protective film forming layer comprises: a pressure-sensitive adhesive sheet 3 which includes a base film 1 and an adhesive layer 2; a heat-curable protective film forming layer 4 which is to be a protective film by heating and which is formed on the adhesive layer of the pressure-sensitive adhesive sheet 3. An adhesive strength between the pressure-sensitive sheet 3 and the protective film is reduced by heating. And a heat generation occurrence temperature of the heat-curable protective film forming layer 4 is lower than an adhesive strength reduction temperature. |
申请公布号 |
JP2013131593(A) |
申请公布日期 |
2013.07.04 |
申请号 |
JP20110279304 |
申请日期 |
2011.12.21 |
申请人 |
LINTEC CORP |
发明人 |
SHINODA TOMONORI;KOYAKATA MASAHIRO;TAKANO TAKESHI |
分类号 |
H01L21/301;B32B27/00;C09D201/00;C09J7/02;C09J201/00;H01L23/00 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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