| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package with high strength for jointing to a metallic member via a metallization layer provided on a ceramic substrate and a jointing member, and with excellent airtightness.SOLUTION: A ceramic package has a metallization layer 3 circumferentially arranged on a surface of a ceramic substrate 1, and a metallic member 5 is jointed via a jointing member 7 formed on an upper face of the metallization layer 3. The jointing member 7 is distributed so that one part thereof penetrates through the metallization layer 3. Jointing strength and airtightness of the metallization layer 3 can be improved, and therefore, a thickness of a substrate bank part 1b of the ceramic substrate 1 constituting the ceramic package is thin, and suitable for even a small ceramic package with a narrow width of the metallization layer 3 formed on its upper face. |
