发明名称 CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide conductive particles and an anisotropic conductive material capable of enhancing connection reliability when used in electrical connection between the electrodes.SOLUTION: Conductive particles 1, 11, 21 include, respectively, a base material particle 2, and a solder layer 4, 22 arranged on the surface 2a of the base material particle 2. In the conductive particles 1, 11, 21, the grain aggregate in the solder layer 4, 22 is larger on the outer surface side than on the inner surface side of the solder layer 4, 22 in the thickness direction, or larger on the inner surface side than on the outer surface side of the solder layer 4, 22 in the thickness direction. The anisotropic conductive material contains the conductive particles 1, 11, 21, and a binder resin.
申请公布号 JP2013131321(A) 申请公布日期 2013.07.04
申请号 JP20110278452 申请日期 2011.12.20
申请人 SEKISUI CHEM CO LTD 发明人 SAITO SATOSHI;ISHIZAWA HIDEAKI
分类号 H01B5/00;C08J3/12;C08L101/00;H01B1/00;H01B1/20;H01B5/16;H01R11/01 主分类号 H01B5/00
代理机构 代理人
主权项
地址