发明名称 APPARATUS AND METHOD FOR ELECTROPLATING
摘要 A processed product is continuously partially plated without being covered. Electroplating is carried out on a portion other than a head of a processed product also having a lower part and a constricted part between the head and the lower part. A pair of rails has an opening between the rails narrower than the head and broader than the constricted part, and electrodes are arranged thereon. A plating bath is positioned below the rails, and electrode plates are arranged in a plating solution. The constricted part of the processed product is positioned at the opening between the rails, and a pushing element extending from above the rails through the opening contacts the processed product at a position lower than the center of gravity at the lower part. The pushing element is displaced along the rails to plate a portion of the processed products positioned below the rails.
申请公布号 KR101282168(B1) 申请公布日期 2013.07.04
申请号 KR20120000440 申请日期 2012.01.03
申请人 发明人
分类号 C25D5/02;C25D17/06;C25D19/00 主分类号 C25D5/02
代理机构 代理人
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