THERMOSETTING RESIN COMPOSITION, PREPREG FOR HEATING PRESSURE MOLDING, AND LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can provide an insulating layer having satisfactory circuit filling properties and heat conductivity, and a prepreg for heating pressure molding.SOLUTION: The thermosetting resin composition includes an inorganic filler. The inorganic filler is composed of a component (a) having an average particle size of 10 μm or more and 70 μm or less, a component (b) having an average particle size of 1 μm or more and less than 10 μm, and a component (c) having an average particle size of 0.1 μm or more and less than 1 μm. The volume ratio of the total volume of the components (a) and (b) to the volume of the component (c) is 90:10 to 70:30, and the total content of the inorganic filler in the volume of the thermosetting resin solid content plus the inorganic filler is 30-80 vol.%. Preferably, the volume ratio of the volume of the component (a) to the volume of the component (b) is 75:25 to 60:40.